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M95160-R Fiches technique(PDF) 7 Page - STMicroelectronics |
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M95160-R Fiches technique(HTML) 7 Page - STMicroelectronics |
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7 / 47 page ![]() DocID022580 Rev 5 7/47 M95160 M95160-W M95160-R M95160-DF Description 46 Figure 2. 8-pin package connections (top view) 1. See Section 10: Package mechanical data for package dimensions, and how to identify pin-1. Figure 3. WLCSP connections (top view, marking side, with bumps on the underside) Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet (UV) light, EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must never be exposed to UV light. |
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