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TCS3404CS Fiches technique(PDF) 39 Page - ams AG |
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TCS3404CS Fiches technique(HTML) 39 Page - ams AG |
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39 / 41 page ![]() TCS3404, TCS3414 DIGITAL COLOR SENSORS TAOS137A − APRIL 2011 38 r r Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MANUFACTURING INFORMATION The CS and FN packages have been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Table 12. Solder Reflow Profile PARAMETER REFERENCE TCS3404/14 Average temperature gradient in preheating 2.5 °C/sec Soak time tsoak 2 to 3 minutes Time above 217 °C (T1) t1 Max 60 sec Time above 230 °C (T2) t2 Max 50 sec Time above Tpeak −10°C (T3) t3 Max 10 sec Peak temperature in reflow Tpeak 260 ° C (−0°C/+5°C) Temperature gradient in cooling Max −5 °C/sec t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 35. Solder Reflow Profile Graph |
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