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AS2533 Fiches technique(PDF) 21 Page - ams AG |
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AS2533 Fiches technique(HTML) 21 Page - ams AG |
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21 / 26 page ![]() Data She et AS25 33-36 austriamicrosystems Revision 8.10 Page 20 of 25 Bond Pad Layout Bond Options Product Version Bond Pad Connection AS2533 BOND_AS2535 BOND_AS2536 not bonded not bonded AS2534/34R (1) BOND_AS2535 BOND_AS2536 not bonded bonded to MODE AS2535 BOND_AS2535 BOND_AS2536 bonded to MODE not bonded AS2536 BOND_AS2535 BOND_AS2536 not bonded bonded to MODE (1) For deliveries as packaged devices (SOIC28), LNR only is tested, direct and indirect memories are not tested! |
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