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AS1331

Datasheet - D e t a i l e d D e s c r i p t i o n

Other AS1331 Features

Shutdown

The part is in shutdown mode while the voltage at pin EN is below 0.4V and is active when the voltage is higher than

1.4V.

Note:

Output Disconnect and Inrush Limiting

current is also limited at turn-on mode to minimize the surge currents seen by the input supply. These features of the

AS1331 are realized by opening both P-channel MOSFETs of the rectifiers, allowing a true output disconnect.

Power-OK and Low-Battery-Detect Functionality

LBO goes low in startup mode as well as during normal operation if:

- The voltage at the LBI pin is below LBI threshold (1.25V). This can be used to monitor the battery voltage.

this case.

The LBI pin can be connected to a resistive-divider to monitor a particular definable voltage and compare it with a

1.25V internal reference. If LBI is connected to GND an internal resistive-divider is activated and connected to the

output. Therefore, the Power-OK functionality can be realised with no additional external components.

The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to

connect a pull-up resistor from pin LBO to pin VOUT. Larger values for this resistor will help to minimize current

consumption; a 100k

Ω resistor is perfect for most applications (see Figure 25 on page 12).

For the circuit shown in the left of Figure 24 on page 12, the input bias current into LBI is very low, permitting large-

value resistor-divider networks while maintaining accuracy. Place the resistor-divider network as close to the device as

Where:

In case of the LBI pin is connected to GND, an internal resistor-devider network is activated and compares the output

voltage with a 92.5% voltage threshold. For this particular Power-OK application, no external resistive components are

necessary.

Thermal Shutdown

To prevent the AS1331 from short-term misuse and overload conditions the chip includes a thermal overload

protection. To block the normal operation mode all switches will be turned off. The device is in thermal shutdown when

the junction temperature exceeds 145°C. To resume the normal operation the temperature has to drop below 135°C.

A good thermal path has to be provided to dissipate the heat generated within the package. Otherwise it’s not possible

to operate the AS1331 at its useable maximal power. To dissipate as much heat as possible away from the package

into a copper plane with as much area as possible, it’s recommended to use multiple vias in the printed circuit board.

It’s also recommended to solder the Exposed Pad (pin 11) to the GND plane.

Note:

Continuing operation in thermal overload conditions may damage the device and is considered bad practice.

(EQ 1)

R

4

R

5

V

IN

V

LBI

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1

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