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PCA9512ADP Fiches technique(PDF) 13 Page - NXP Semiconductors |
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PCA9512ADP Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 27 page  PCA9512A_PCA9512B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 6 — 1 March 2013 13 of 27 NXP Semiconductors PCA9512A; PCA9512B Level shifting hot swappable I2C-bus and SMBus bus buffer 8.11 Additional system compromises • Additional parts • Additional assembly cost • Reduced system reliability due to complexity • Reduced logic level noise margin (immunity) • Sensitivity to ground offsets between sub-systems (cable links, for example) • Increased loading on the low voltage side (must carry the high voltage side sink current) • ESD robustness 9. Application design-in information Fig 10. Typical application 002aab794 ACC GND R5 10 kΩ R3 10 kΩ R4 10 kΩ SDAOUT SCLOUT C2 0.01 μF R1 10 kΩ R2 10 kΩ VCC (5 V) SDAIN SCLIN PCA9512A SDA SCL VCC VCC2 C1 0.01 μF CARD_VCC (3 V) CARD_SDA CARD_SCL |
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