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STM8S103F2 Fiches technique(PDF) 7 Page - STMicroelectronics |
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STM8S103F2 Fiches technique(HTML) 7 Page - STMicroelectronics |
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7 / 117 page ![]() Figure 48. 32-lead shrink plastic DIP (400 ml) package ........................................................................98 Figure 49. 20-pin, 4.40 mm body, 0.65 mm pitch .................................................................................101 Figure 50. 20-lead, plastic small outline (300 mils) package ...............................................................101 Figure 51. Recommended footprint for on-board emulation ................................................................102 Figure 52. Recommended footprint without on-board emulation .........................................................103 Figure 53. STM8S103x access line ordering information scheme ......................................................106 7/117 DocID15441 Rev 9 List of figures STM8S103K3 STM8S103F3 STM8S103F2 |
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