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ADMP504ACEZ Fiches technique(PDF) 11 Page - Analog Devices |
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ADMP504ACEZ Fiches technique(HTML) 11 Page - Analog Devices |
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11 / 12 page ![]() Data Sheet ADMP504 Rev. 0 | Page 11 of 12 OUTLINE DIMENSIONS 2.575 2.500 2.425 3.425 3.350 3.275 TOP VIEW SIDE VIEW REFERENCE CORNER 0.98 0.88 0.78 0.21 REF 2.21 REF 3.06 REF 0.65 REF BOTTOM VIEW 1.08 0.95 DIA. 0.25 NOM 0.20 MIN DIA. THRU HOLE (SOUND PORT) 1.22 BSC 1.25 0.54 REF 0.64 REF 1.56 DIA. 1.52 0.75 REF 0.30 BSC 1 3 2 0.90 × 0.68 (PINS 1, 3) 0.20 TYP × 45° 0.30 BSC PIN 1 Figure 12. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.35 mm × 2.50 mm Body (CE-3-2) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option2 Ordering Quantity ADMP504ACEZ-RL −40°C to +85°C 3-Terminal LGA_CAV, 13”Tape and Reel CE-3-2 10,000 ADMP504ACEZ-RL7 −40°C to +85°C 3-Terminal LGA_CAV, 7”Tape and Reel CE-3-2 1,000 EVAL-ADMP504Z-FLEX Flex Evaluation Board 1 Z = RoHS Compliant Part. 2 This package option is halide free. |
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