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GLA02 Fiches technique(PDF) 9 Page - List of Unclassifed Manufacturers |
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GLA02 Fiches technique(HTML) 9 Page - List of Unclassifed Manufacturers |
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9 / 11 page ![]() SPE-12-8-042/A/SS Page 9 of 11 VI. Layout Guide VI.1 Solder Land pattern Land pattern for soldering (grey marked areas) is as shown below. Depending on Customers requirement, matching circuit as shown below is also recommended. The footprint is 11*5.7mm, this antenna does not need ground removed on the back-side of the PCB thus allowing other components to be placed there on crowded boards. VI.2 Matching Circuit The most common matching arrangement is the pi matching as shown below. We have 2.2pF capacitor for Component 3 and 0Ohm resister for Component 2 on EVB. 5.1 3D Gain Pattern |
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