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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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W25Q32FVZPIP Fiches technique(PDF) 9 Page - Winbond |
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W25Q32FVZPIP Fiches technique(HTML) 9 Page - Winbond |
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9 / 99 page  W25Q32FV Publication Release Date: Sept 16,, 2013 - 8 - Revision H 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) Figure 1d. W25Q32FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB & TC) 3.7 Ball Description TFBGA 8x6-mm BALL NO. PIN NAME I/O FUNCTION B2 CLK I Serial Clock Input B3 GND Ground B4 VCC Power Supply C2 /CS I Chip Select Input C4 /WP (IO2) I/O Write Protect Input (Data Input Output 2) (2) D2 DO (IO1) I/O Data Output (Data Input Output 1) (1) D3 DI (IO0) I/O Data Input (Data Input Output 0) (1) D4 /HOLD or /RESET (IO3) I/O Hold or Reset Input (Data Input Output 3) (2) Multiple NC No Connect Notes: 1. IO0 and IO1 are used for Standard and Dual SPI instructions 2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI. |
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