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LPC2104FBD48 Fiches technique(PDF) 37 Page - NXP Semiconductors |
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LPC2104FBD48 Fiches technique(HTML) 37 Page - NXP Semiconductors |
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37 / 41 page ![]() LPC2104_2105_2106_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 07 — 20 June 2008 37 of 41 NXP Semiconductors LPC2104/2105/2106 Single-chip 32-bit microcontrollers Fig 14. Package outline SOT619-1 (HVQFN48) 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 7.1 6.9 Dh 5.25 4.95 y1 7.1 6.9 5.25 4.95 e1 5.5 e2 5.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT619-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT619-1 HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 13 24 48 37 36 25 12 1 X D E C B A e2 01-08-08 02-10-18 terminal 1 index area terminal 1 index area 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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