MP8715DN datasheet(2/19 Pages) MPS

2 / 19 page

MP8715 – 4A, 21V, 500kHz, STEP DOWN CONVERTER WITH 100% DUTY CYCLE OPERATION

MP8715 Rev. 1.01

www.MonolithicPower.com

6/13/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP8715DN*

SOIC8E

MP8715

MP8715DL**

3x4 QFN14

MP8715

* For Tape & Reel, add suffix –Z (e.g. MP8715DN–Z);

For RoHS compliant packaging, add suffix –LF (e.g. MP8715DN–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP8715DL–Z);

For RoHS compliant packaging, add suffix –LF (e.g. MP8715DL–LF–Z)

PACKAGE REFERENCE

ABSOLUTE MAXIMUM RATINGS (1)

VIN……………………………………-0.3V to 23V

SW…… ……………-0.3V (-5V for <10ns) to 23V

FB, SS…………....…….. …………–0.3V to +6.5V

EN/SYNC, POK, VCC.... …………–0.3V to +6.5V

BST to SW ..................................–0.3V to +6.5V

Continuous Power Dissipation (TA = +25°C)

(2)

SOIC8E...................................................... 2.5W

3x4 QFN14 ................................................ 2.6W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature ..............–65°C to +150°C

Recommended Operating Conditions

(3)

Input Voltage VIN ..............................4.5V to 21V

Output Voltage VOUT...........................0.8V to VIN

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E (Exposed Pad).......... 50...... 10 ..

°C/W

3x4 QFN14.......... ....................48...... 11 ..

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

VIN

BST

EN/SYNC

VCC

POK

GND

TOP VIEW

PIN 1 ID

GND

VCC

POK

BST

EN/SYNC

TOP VIEW

EXPOSED PAD

ON BACKSIDE

SOIC8E

3x4 QFN14

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