| Moteur de recherche de fiches techniques de composants électroniques |
|
MP2372DN Fiches technique(PDF) 2 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP2372DN Fiches technique(HTML) 2 Page - Monolithic Power Systems |
|
2 / 13 page ![]() MP2372 – 3A, 28V, 925KHZ STEP-DOWN CONVERTER MP2372 Rev. 0.92 www.MonolithicPower.com 2 12/22/2009 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2009 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP2372DN SOIC8N MP2372DN –40 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP2372DN–Z). For RoHS compliant packaging, add suffix –LF (eg. MP2372DN–LF–Z) PACKAGE REFERENCE BS IN SW GND SS EN COMP FB 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD CONNECT TO PIN 4 ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN .......................–0.3V to +30V Switch Voltage VSW .....-1V (-5V for 10ns) to 31V Boost Voltage VBS ................................ VSW + 6V All Other Pins.................................–0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) …………………………………………………2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature ............. –65 °C to +150°C Recommended Operating Conditions (3) Input Voltage VIN ..............................4.5V to 28V Operating Junct. Temp (TJ)..... –40°C to +125°C Thermal Resistance (4) θJA θJC SOIC8N...................................50 ...... 10 ... °C/W Notes: 1) Exceeding these ratings may damage the device 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage.. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |