AD8366 datasheet(28/28 Pages) AD

28 / 28 page

AD8366

Rev. A | Page 28 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

2.85

2.70 SQ

2.55

TOP

VIEW

COPLANARITY

0.08

3.50 REF

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.20 MIN

EXPOSED

PAD

(BOTTOM VIEW)

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50

0.40

0.30

5.00

BSC SQ

4.75

BSC SQ

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 63. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8366ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-8

AD8366-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D07584-0-3/11(A)

AD8366 Fiches technique(PDF) 28 Page - Analog Devices

AD8366 Fiches technique(HTML) 28 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

Fiches technique Télécharger

Lien URL