BAV23_SER_7

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 07 — 19 March 2010

8 of 13

NXP Semiconductors

BAV23 series

Dual high-voltage switching diodes

11. Soldering

Fig 9.

Reflow soldering footprint SOT23 (TO-236AB)

Fig 10. Wave soldering footprint SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3

×)

0.6

(3

×)

0.6

(3

×)

0.7

(3

×)

3

1

3.3

2.9

1.7

1.9

2

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2

×)

1.2

(2

×)

2.2

2.6

Dimensions in mm