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APA2175 Fiches technique(PDF) 13 Page - Anpec Electronics Coropration |
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APA2175 Fiches technique(HTML) 13 Page - Anpec Electronics Coropration |
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13 / 19 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.3 - Jul., 2010 www.anpec.com.tw 13 APA2175 Application Information (Cont.) Layout Consideration (Cont.) 1. All components should be placed close to the APA2175. For example, the input capacitor (C i) should be close to APA2175’s input pins to avoid causing noise coupling to APA2175’s high impedance inputs; the decoupling capacitor (C S) should be placed by the APA2175’ s power pin to decouple the power rail noise. 2. The output traces should be short and wide (>20mil). 3. The input trace should be short and symmetric. 4. The power trace width should be greater than 20mil. 5. The TQFN Thermal PAD should be soldered on PCB, and the ground plane needs soldered mask (to avoid short circuit) except the Thermal PAD area. |
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