Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Aug., 2013

www.anpec.com.tw

3

APA2011/2011A

Symbol

Parameter

Rating

Unit

Maximum Lead Soldering Temperature, 10 Seconds

260

Power Dissipation

Internally Limited

W

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under

"recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods

may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

WLCSP1.5x1.5-9

TDFN3x3-8

165

50

θ

JC

Thermal Resistance -Junction to Case

(Note 3)

TDFN3x3-8

10

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

Thermal Pad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz

copper thickness.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TDFN3x3-8 package.

Recommended Operating Conditions

Range

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

2.4

5.5

High Level Threshold Voltage

SD

1

-

Low Level Threshold Voltage

SD

-

0.4

Common Mode Input Voltage

-

V

Ambient Temperature Range

-40

85

Junction Temperature Range

-40

125

Speaker Resistance

2.8

-

Ω

Electrical Characteristics

APA2011/2011A

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Current

-

3

6

mA

Shutdown Current

SD = 0V

-

1

5

Input Current

SD

-

0.1

1

µA

Oscillator Frequency

400

500

600

kHz

Recovery Time from Shutdown

-

4

8

ms

Input Resistor

INN, INP

23.75

25

26.25

DR Pin Pull-high Resistor

9.5

10

10.5

k

Ω

Static Drain-Source On-State

Resistance

(PMOSFET+NMOSFET)

WLCSP1.5x1.5-9

-

780

-

m

Ω

V