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APA0713 Fiches technique(PDF) 13 Page - Anpec Electronics Coropration |
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APA0713 Fiches technique(HTML) 13 Page - Anpec Electronics Coropration |
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13 / 19 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.2 - Apr., 2012 APA0713 www.anpec.com.tw 13 Application Information (Cont.) Power Dissipation (Cont.) For SOP-8 package, the thermal resistance ( θ JA) is equal to 200οC/W, respectively. Since the maximum junction temperature (T J,MAX) o f APA0713 is 170οC and the ambient temperature (T A) is defined by the power system design, the maximum power dissipation which the IC package is able to handle can be obtained from equation 11. Once the power dissi- pation is greater than the maximum limit (P D,MAX), either the supply voltage (V DD) must be decreased, the load im- pedance (R L) must be increased, or the ambient tem- perature should be reduced. |
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