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07XSC200 Fiches technique(PDF) 46 Page - Freescale Semiconductor, Inc |
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07XSC200 Fiches technique(HTML) 46 Page - Freescale Semiconductor, Inc |
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46 / 51 page ![]() Analog Integrated Circuit Device Data 46 Freescale Semiconductor 07XSC200 7 Packaging 7.1 Soldering Information The 07XSC200 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 07XSC200 was qualified in accordance with JEDEC standards J-STD-020C Pb-Free reflow profile. The maximum peak temperature during the soldering process should not exceed 260 °C for 40 seconds maximum duration. |
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