PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

AM26LS32CN

NRND

PDIP

NFG

16

25

TBD

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0 to 70

DS26LS32CN

AM26LS32PC

NRND

PDIP

NFG

16

25

TBD

Call TI

Call TI

0 to 70

DS26LS32CN

DS26LS32ACM

NRND

SOIC

D

16

48

TBD

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Call TI

0 to 70

DS26LS32

ACM

DS26LS32ACM/NOPB

ACTIVE

SOIC

D

16

48

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

DS26LS32

ACM

DS26LS32ACMX

NRND

SOIC

D

16

2500

TBD

Call TI

Call TI

0 to 70

DS26LS32

ACM

DS26LS32ACMX/NOPB

ACTIVE

SOIC

D

16

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

DS26LS32

ACM

DS26LS32ACN

NRND

PDIP

NFG

16

25

TBD

Call TI

Call TI

0 to 70

DS26LS32ACN

DS26LS32ACN/NOPB

ACTIVE

PDIP

NFG

16

25

Pb-Free

(RoHS)

CU SN

Level-1-NA-UNLIM

0 to 70

DS26LS32ACN

DS26LS32CM

NRND

SOIC

D

16

48

TBD

Call TI

Call TI

0 to 70

DS26LS32CM

DS26LS32CM/NOPB

ACTIVE

SOIC

D

16

48

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

DS26LS32CM

DS26LS32CMX

NRND

SOIC

D

16

2500

TBD

Call TI

Call TI

0 to 70

DS26LS32CM

DS26LS32CMX/NOPB

ACTIVE

SOIC

D

16

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

DS26LS32CM

DS26LS32CN

NRND

PDIP

NFG

16

25

TBD

Call TI

Call TI

0 to 70

DS26LS32CN

DS26LS32CN/NOPB

ACTIVE

PDIP

NFG

16

25

Pb-Free

(RoHS)

SN

Level-1-NA-UNLIM

0 to 70

DS26LS32CN

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.