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STM32L152C6 Fiches technique(PDF) 50 Page - STMicroelectronics

No de pièce STM32L152C6
Description  Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC
PDF  121 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L152C6 Fiches technique(HTML) 50 Page - STMicroelectronics

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Electrical characteristics
STM32L151x6/8/B, STM32L152x6/8/B
50/121
Doc ID 17659 Rev 8
6.3
Operating conditions
6.3.1
General operating conditions
Table 13.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 14.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
32
MHz
fPCLK1
Internal APB1 clock frequency
0
32
fPCLK2
Internal APB2 clock frequency
0
32
VDD
Standard operating voltage
BOR detector disabled
1.65
3.6
V
BOR detector enabled,
at power on
1.8
3.6
BOR detector disabled,
after power on
1.65
3.6
VDDA
(1)
1.
When the ADC is used, refer to Table 54: ADC characteristics.
Analog operating voltage
(ADC and DAC not used)
Must be the same voltage
as VDD
(2)
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
1.65
3.6
V
Analog operating voltage
(ADC or DAC used)
1.8
3.6
P
D
Power dissipation at
TA = 85 °C
(3)
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 68: Thermal
characteristics on page 114).
BGA100 package
339
mW
TA
Temperature range
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJ max
(see Table 68: Thermal characteristics on page 114).
–40
105
TJ
Junction temperature range
-40 °C
≤ TA ≤ 105 °C
–40
105
°C



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