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LSM9DS0TR Fiches technique(PDF) 30 Page - STMicroelectronics |
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LSM9DS0TR Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 74 page ![]() Application hints LSM9DS0 30/74 DocID024763 Rev 2 5.2 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendation are available at www.st.com/mems. 5.3 High current wiring effects High current in wiring and printed circuit traces can be culprits in causing errors in magnetic field measurements for compassing. Conductor-generated magnetic fields will add to the Earth’s magnetic field leading to errors in compass-heading computation. Keep currents higher than 10 mA a few millimeters further away from the sensor IC. |
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