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STPS2L60RL Fiches technique(PDF) 6 Page - STMicroelectronics |
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STPS2L60RL Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 9 page ![]() Package information STPS2L60 6/9 Doc ID 9173 Rev 6 2 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 17. SMB flat footprint dimensions The footprint in Figure 17 has been optimized for the SMB flat package. The footprint of the SMB package can be used instead. Table 5. SMB flat dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 D A L 2x L L1 2x L2 2x E E1 b c 1.20 (0.047) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082) millimeters (inches) |
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