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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MIC2870YFT Fiches technique(PDF) 21 Page - Micrel Semiconductor |
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MIC2870YFT Fiches technique(HTML) 21 Page - Micrel Semiconductor |
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21 / 25 page  Micrel, Inc. MIC2870 September 5, 2013 21 Revision 1.0 Figure 5. Graph to Determine PC Board Area for a Given PCB Thermal Resistance Figure 5 shows the total area of a round or square pad, centered on the device. The solid trace represents the area of a square, single sided, horizontal, solder masked, copper PC board trace heat sink, measured in square millimeters. No airflow is assumed. The dashed line shows PC boards trace heat sink covered in black oil- based paint and with 1.3m/sec (250 feet per minute) airflow. This approaches a “best case” pad heat sink. Conservative design dictates using the solid trace data, which indicates that a maximum pad size of 5000 mm 2 is needed. This is a pad 71mm × 71mm (2.8 inches per side). |
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