BCP53_13 datasheet(6/22 Pages) NXP

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BCP53_BCX53_BC53PA

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Product data sheet

Rev. 9 — 19 October 2011

6 of 22

NXP Semiconductors

BCP53; BCX53; BC53PA

80 V, 1 A PNP medium power transistors

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

[4]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.

[5]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

BCP53

[1] --

192

K/W

[2] --

125

K/W

[3] --

K/W

BCX53

[1] --

250

K/W

[2] --

132

K/W

[3] --

K/W

BC53PA

[1] --

298

K/W

[2] --

151

K/W

[3] --

114

K/W

[4] --

154

K/W

[5] --

K/W

Rth(j-sp)

thermal resistance from

junction to solder point

BCP53

K/W

BCX53

K/W

BC53PA

K/W

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