RXB0D2 datasheet(77/92 Pages) MICROCHIP

77 / 92 page

 2003-2012 Microchip Technology Inc.

DS21801G-page 77

MCP2515

14.0

PACKAGING INFORMATION

14.1

Package Marking Information

18-Lead PDIP (300 mil)

18-Lead SOIC (300 mil)

20-Lead TSSOP (4.4 mm)

XXXXXXXX

XXXXXNNN

YYWW

XXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXXXXXXX

YYWWNNN

Example:

MCP2515

IST ^ 256

1035

MCP2515

1035256

MCP2515-I/P^^

0434256

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

E/SO^^

XXXXX

20-Lead QFN (4x4)

YWWNNN

Example:

XXXXXX

2515

035256

E/ML^^3

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