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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MCR03EZPFX1002 Fiches technique(PDF) 31 Page - International Rectifier |
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MCR03EZPFX1002 Fiches technique(HTML) 31 Page - International Rectifier |
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31 / 32 page  Rev 16.0 31 PD-97660 IR3831WMPbF Stencil Design • The Stencil apertures for the lead lands should be approximately 80% of the area of the lead lads. Reducing the amount of solder deposited will minimize the occurrences of lead shorts. If too much solder is deposited on the center pad the part will float and the lead lands will be open. • The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is pushed into the solder paste. |
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