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HCS244D/Sample Fiches technique(PDF) 10 Page - Intersil Corporation

No de pièce HCS244D/Sample
Description  Radiation Hardened Octal Buffer/Line Driver, Three-State
PDF  10 Pages
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Fabricant  INTERSIL [Intersil Corporation]
Site Internet  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HCS244D/Sample Fiches technique(HTML) 10 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
HCS244MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: Al/Sil
Metal Thickness: 11k
Å
± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13k
Å
± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100
µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS244MS
(18) Y0 1
(17) A3 2
(16) Y1 1
(15) A2 2
(14) Y2 1
(13)
(12)
A1 2
Y3 1
(11)
A0 2
(10)
GND
(9)
Y0 2
(8)
A3 1
VCC
(20)
OE 2
(19)
OE
(1)
A0 1
(2)
Y3 2
(3)
A1 1 (4)
Y2 2 (5)
A2 1 (6)
Y1 2 (7)
Spec Number
518763



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