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AD7960BCPZ Fiches technique(PDF) 23 Page - Analog Devices |
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AD7960BCPZ Fiches technique(HTML) 23 Page - Analog Devices |
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23 / 24 page ![]() Data Sheet AD7960 Rev. 0 | Page 23 of 24 OUTLINE DIMENSIONS Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad (CP-32-7) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD7960BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 AD7960BCPZ-RL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 EVAL-AD7960FMCZ Evaluation Board 1 Z = RoHS Compliant Part. COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 EXPOSED PAD PIN 1 INDICATOR 3.25 3.10 SQ 2.95 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.80 0.75 0.70 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.50 0.40 0.30 0.25 MIN |
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