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ADP125ARHZ-R7 Fiches technique(PDF) 15 Page - Analog Devices

No de pièce ADP125ARHZ-R7
Description  5.5 V Input, 500 mA, Low Quiescent Current, CMOS Linear Regulators
PDF  20 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADP125ARHZ-R7 Fiches technique(HTML) 15 Page - Analog Devices

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Data Sheet
ADP124/ADP125
Rev. C | Page 15 of 20
JUNCTION TEMPERATURE CALCULATIONS
25
35
45
55
65
75
85
95
105
115
125
135
145
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 36. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 25°C
25
35
45
55
65
75
85
95
105
115
125
135
145
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 37. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 25°C
50
60
70
80
90
100
110
120
130
140
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 38. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 50°C
50
60
70
80
90
100
110
120
130
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 39. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 50°C
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 40. Junction Temperature vs. Power Dissipation, MSOP package
at various Board Temperatures
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 41. Junction Temperature vs. Power Dissipation, LFCSP package
at various Board Temperatures



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