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ADP124ARHZ-3.3-R7 Fiches technique(PDF) 16 Page - Analog Devices |
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ADP124ARHZ-3.3-R7 Fiches technique(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP124/ADP125 Data Sheet Rev. C | Page 16 of 20 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP124/ADP125. However, as shown in Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. The input capacitor should be placed as close as possible to the VIN and GND pins, and the output capacitor should be placed as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where the area is limited. Figure 42. Example ADP124 MSOP PCB Layout Figure 43. Example ADP125 MSOP PCB Layout Figure 44. Example ADP124/ADP125 LFCSP PCB Layout |
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