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EZACT Fiches technique(PDF) 7 Page - Panasonic Semiconductor |
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EZACT Fiches technique(HTML) 7 Page - Panasonic Semiconductor |
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7 / 9 page ![]() Chip RC Networks Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. GND c f2 b P Land pattern Solder resistant GND f2 P c db Land pattern Land pattern P b g c g c P b Land pattern h g c P b Land pattern ■ Recommended Land Pattern Design ●EZAST/SS ●EZACT ●EZASTB/SSB ●EZANT • Design to make GND pattern as large as possible, because high frequency noise is removed from GND terminals of chip RC network. abcd Dimensions (mm) 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 ef1 f2 P Dimensions (mm) 0.8 2.9 to 3.3 4.8 to 5.2 0.8 abcd Dimensions (mm) 0.75 0.25 1.70 0.35 eh g P Dimensions (mm) 1.85 2.60 0.25 0.60 abcd Dimensions (mm) 1.4 to 1.6 0.35 0.45 0.3 f1 f2 P Dimensions (mm) 2.7 to 3.5 3.8 0.65 abcd Dimensions (mm) 2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8 fg P Dimensions (mm) 4.3 to 4.7 7.6 to 8.0 1.27 ●EZADT abcd Dimensions (mm) 0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4 fg P Dimensions (mm) 2.0 to 2.6 3.6 to 4.2 0.635 Feb. 2006 |
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