ADA4700-1

Preliminary Technical Data

Rev. PrB | Page 8 of 10

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

110 V

Input Voltage

Differential Input Voltage

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by a plastic

encapsulated package is limited by the junction temperature.

The maximum safe junction temperature for plastic encapsulated

devices, as determined by the glass transition temperature of the

plastic, is approximately 150°C. Exceeding this limit temporarily

may cause a shift in the parametric performance due to a

change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175°C for an extended

period can result in device failure.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

Unit

8-Lead SOIC_N_EP (RD-8-2)

TBD

TBD

C/W

ESD CAUTION