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RC2012J000CS Fiches technique(PDF) 13 Page - Samsung semiconductor

No de pièce RC2012J000CS
Description  Thick Film Chip Resistor ( General )
PDF  19 Pages
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Fabricant  SAMSUNG [Samsung semiconductor]
Site Internet  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC2012J000CS Fiches technique(HTML) 13 Page - Samsung semiconductor

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TAPING METHOD
There are empty holes at both start part and end part of carrier tape. <Fig 5>
<Fig 5>
Reel
Packed Part
Empty Part
Lead Part
Adhesion Tape
***
**
****
Empty Portion
Chips
Empty Portion
Lead Part
10 Pitches
or more
5,000 Pitches
or
20,000 Pitches
10 Pitches
or more
200~250 mm
Note
①
The resistor should move in the pocket freely.
②
The resistor should not adhere to the top or bottom tape.
③
There should be no vacant pocket.
④
Peeling strength of the top tape should be within 5gf and 80gf. <Fig 6>
<Fig 6>
0~10°
Top Tape
Chip Resistor
Carrier Tape
Bottom Tape
F
Peeling



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