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TL331KDBVR Fiches technique(PDF) 2 Page - Texas Instruments

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No de pièce TL331KDBVR
Description  SINGLE DIFFERENTIAL COMPARATOR
PDF  10 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TL331KDBVR Fiches technique(HTML) 2 Page - Texas Instruments

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IN+
IN−
OUT
80-
µA
Current Regulator
80
µA
60
µA
10
µA
VCC
10
µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
COMPONENT COUNT
1
2
1
20
ABSOLUTE MAXIMUM RATINGS
(1)
TL331
SLVS238F – AUGUST 1999 – REVISED JULY 2008 ......................................................................................................................................................... www.ti.com
LOGIC DIAGRAM
SCHEMATIC
Note:
Current values shown are nominal.
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage(2)
36 V
VID
Differential input voltage(3)
±36 V
VI
Input voltage range (either input)
–0.3 V to 36 V
VO
Output voltage
36 V
IO
Output current
20 mA
Duration of output short-circuit to ground(4)
Unlimited
θ
JA
Package thermal impedance(5)(6)
206°C/W
TJ
Operating virtual junction temperature
150°C
Tstg
Storage temperature range
–65°C to 150°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to the network ground.
(3)
Differential voltages are at IN+ with respect to IN–.
(4)
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5)
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
2
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Copyright © 1999–2008, Texas Instruments Incorporated
Product Folder Link(s): TL331



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