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VNQ660SPTR-E Fiches technique(PDF) 22 Page - STMicroelectronics |
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VNQ660SPTR-E Fiches technique(HTML) 22 Page - STMicroelectronics |
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22 / 26 page ![]() Package and packing information VNQ660SP 22/26 5 Package and packing information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of Second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. 5.2 PowerSO-10 mechanical data Figure 29. PowerSO-10 package dimensions DETAIL "A" PLANE SEATING α L A1 F A1 h A D D1 = = = = E4 0.10 A E C A B B DETAIL "A" SEATING PLANE E2 10 1 eB HE 0.25 |
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