AD8331ARQZ-R7 datasheet(54/56 Pages) AD

54 / 56 page

AD8331/AD8332/AD8334

Rev. G | Page 54 of 56

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

PIN 1

INDICATOR

TOP

VIEW

8.75

BSC SQ

9.00

BSC SQ

0.50

0.40

0.30

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

*4.85

4.70 SQ

4.55

EXPOSED PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

EXCEPT FOR EXPOSED PAD DIMENSION

SEATING

PLANE

PIN 1

INDICATOR

0.30

0.25

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

9 mm × 9 mm Body, Very Thin Quad

(CP-64-1)

Dimensions shown in millimeters

AD8331ARQZ-R7 Fiches technique(PDF) 54 Page - Analog Devices

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