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AD5665BCPZ-R2 Fiches technique(PDF) 33 Page - Analog Devices |
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AD5665BCPZ-R2 Fiches technique(HTML) 33 Page - Analog Devices |
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33 / 36 page ![]() Data Sheet AD5625R/AD5645R/AD5665R, AD5625/AD5665 Rev. C | Page 33 of 36 OUTLINE DIMENSIONS Figure 75. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters Figure 76. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters 2.48 2.38 2.23 0.50 0.40 0.30 10 1 6 5 0.30 0.25 0.20 PIN 1 INDEX AREA SEATING PLANE 0.80 0.75 0.70 1.74 1.64 1.49 0.20 REF 0.05 MAX 0.02 NOM 0.50 BSC EXPOSED PAD 3.10 3.00 SQ 2.90 PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY 0.08 TOP VIEW BOTTOM VIEW 0.20 MIN COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE |
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