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M24C64-R Fiches technique(PDF) 7 Page - STMicroelectronics |
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M24C64-R Fiches technique(HTML) 7 Page - STMicroelectronics |
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7 / 42 page ![]() M24C64-W M24C64-R M24C64-F M24C64-DF Description Doc ID 16891 Rev 27 7/42 Figure 3. 5-bump WLCSP connections (top view) Note: Inputs E2, E1, E0 are internally connected to (001). Please refer to Section 2.3 for further explanations. Figure 4. 8-bump thin WLCSP connections (top view) Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet (UV) light, EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must never be exposed to UV light. |
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