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TOP232PN Fiches technique(PDF) 35 Page - Power Analog Micoelectronics |
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TOP232PN Fiches technique(HTML) 35 Page - Power Analog Micoelectronics |
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35 / 36 page ![]() TOP232-234 B 7/01 35 Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted. 5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T. .010 (.25) .015 (.38) .300 (7.62) BSC (NOTE 7) .300 (7.62) .390 (9.91) .375 (9.53) .385 (9.78) .245 (6.22) .255 (6.48) .128 (3.25) .132 (3.35) .057 (1.45) .063 (1.60) .125 (3.18) .135 (3.43) 0.15 (.38) MINIMUM .048 (1.22) .053 (1.35) .100 (2.54) BSC .014 (.36) .022 (.56) -E- Pin 1 SEATING PLANE -D- -T- P08B DIP-8B PI-2551-033001 D S .004 (.10) ⊕ T E D S .010 (.25) M ⊕ (NOTE 6) SMD-8B PI-2546-040501 .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) .004 (.10) 0 - ° 8° .375 (9.53) .385 (9.78) .048 (1.22) .009 (.23) .053 (1.35) .032 (.81) .037 (.94) .128 (3.25) .132 (3.35) -D- Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 3. Pin locations start with Pin 1, and continue counter-clock Pin 8 when viewed from the top. Pin 6 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 5. Lead width measured at package body. 6. D and E are referenced datums on the package body. .057 (1.45) .063 (1.60) (NOTE 5) E S .100 (2.54) (BSC) .372 (9.45) .245 (6.22) .388 (9.86) .255 (6.48) .010 (.25) -E- Pin 1 D S .004 (.10) ⊕ ⊕ G08B Heat Sink is 2 oz. Copper As Big As Possible .420 .046 .060 .060 .046 .080 Pin 1 .086 .186 .286 Solder Pad Dimensions |
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