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LM317S/NOPB Fiches technique(PDF) 14 Page - Texas Instruments |
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LM317S/NOPB Fiches technique(HTML) 14 Page - Texas Instruments |
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14 / 38 page ![]() LM117, LM317-N SNVS774L – MAY 2004 – REVISED FEBRUARY 2011 www.ti.com Table 1. θJA Different Heatsink Area Layout Copper Area Thermal Resistance ( θJA°C/W) PFM Top Side (in2)(1) Bottom Side (in2) 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1.0 0 47 7 0.066 0.2 84 8 0.066 0.4 70 9 0.066 0.6 63 10 0.066 0.8 57 11 0.066 1.0 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 (1) Tab of device attached to topside of copper. Figure 33. θJA vs 2oz Copper Area for PFM Figure 34. Maximum Allowable Power Dissipation vs. Ambient Temperature for PFM 14 Submit Documentation Feedback Copyright © 2004–2011, Texas Instruments Incorporated Product Folder Links: LM117 LM317-N |
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