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TC623CEOA Fiches technique(PDF) 7 Page - Microchip Technology |
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TC623CEOA Fiches technique(HTML) 7 Page - Microchip Technology |
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7 / 12 page ![]() 2001-2012 Microchip Technology Inc. DS21441D-page 7 TC623 5.3 Package Dimensions .050 (1.27) Typ. 8 ° Max. Pin 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .053 (1.35) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3° Min. Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging |
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