SST12LP20 datasheet(5/13 Pages) MICROCHIP

5 / 13 page

DS70005049C

05/13

2.4 GHz High-Efficiency, High-Gain Power Amplifier

SST12LP20

Data Sheet

Electrical Specifications

The RF and DC specifications for the power amplifier interface signals. Refer to Table 3 for the DC voltage and

current specifications, Table 4 for RF specifications, and Figures 3 through 8 for the RF performance.

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute

Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these conditions or conditions greater than those defined in the

operational sections of this data sheet is not implied. Exposure beyond absolute maximum stress rat-

ing conditions may affect device reliability.)

Input power to pin 1 (PIN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm

Average output power from pin 4 (POUT)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25.5 dBm

1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the max-

imum rating of average output power could cause permanent damage to the device.

Supply Voltage at pins 5 and 6(VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.8V

Reference voltage to pin 8 (VREF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.0V

DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 mA

2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal

Operating Temperature (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC

Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC

Maximum Junction Temperature (TJ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150ºC

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Table 2: Operating Range

Range

Ambient Temp

VDD

Industrial

-40°C to +85°C

3.3V

T2.1 75049

Table 3: DC Electrical Characteristics at 25°C

Symbol

Parameter

Min.

Typ

Max.

Unit

VCC

Supply Voltage at pins 5 and 6

3.0

3.3

4.2

ICQ

Idle current to meet EVM ~3% @ 18 dBm Output Power, 802.11g OFDM

54 Mbps signal

VREG

Reference Voltage for pin 8

3.05

3.10

3.15

ICC

Current consumption to meet 802.11g OFDM 54 Mbps spectrum

mask @ 21 dBm

140

Current consumption to meet 802.11b DSSS 54 Mbps spectrum

mask @ 21 dBm

140

Current consumption to meet EVM ~3% @ 18 dBm Output Power

with 802.11g OFDM 54 Mbps signal

110

T3.1 75049

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