MCP6491 datasheet(13/50 Pages) MICROCHIP

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 2012-2013 Microchip Technology Inc.

DS20002321C-page 13

MCP6491/2/4

3.0

PIN DESCRIPTIONS

Descriptions of the pins are listed in Table 3-1.

3.1

Analog Outputs

The output pins are low-impedance voltage sources.

3.2

Analog Inputs

The

non-inverting

and

inverting

inputs

are

high-impedance CMOS inputs with low bias currents.

3.3

Power Supply Pins

The positive power supply (VDD) is 2.4V to 5.5V higher

than the negative power supply (VSS). For normal

operation, the other pins are at voltages between VSS

and VDD.

Typically, these parts are used in single-supply opera-

tion. In this case, VSS is connected to ground and VDD

is connected to the supply. VDD will need bypass

capacitors.

3.4

Exposed Thermal Pad (EP)

There is an internal electrical connection between the

Exposed Thermal Pad (EP) and the VSS pin; they must

be connected to the same potential on the Printed

Circuit Board (PCB).

This pad can be connected to a PCB ground plane to

provide a larger heat sink. This improves the package

thermal resistance (



JA).

TABLE 3-1:

PIN FUNCTION TABLE

MCP6491

MCP6492

MCP6494

Symbol

Description

SC70, SOT-23

SOIC, MSOP

2x3 TDFN

SOIC, TSSOP

VOUT, VOUTA

Analog Output (op amp A)

VIN–, VINA–

Inverting Input (op amp A)

VIN+, VINA+

Non-inverting Input (op amp A)

VDD

Positive Power Supply

—5

VINB+

Non-Inverting Input (op amp B)

—6

VINB–

Inverting Input (op amp B)

—7

VOUTB

Analog Output (op amp B)

——

—

VOUTC

Analog Output (op amp C)

——

—

VINC–

Inverting Input (op amp C)

——

—

VINC+

Non-Inverting Input (op amp C)

VSS

Negative Power Supply

——

—

VIND+

Non-Inverting Input (op amp D)

——

—

VIND–

Inverting Input (op amp D)

——

—

VOUTD

Analog Output (op amp D)

—

Exposed Thermal Pad (EP);

must be connected to VSS.

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