WM9090ECSSLASHR datasheet(80/81 Pages) WOLFSON

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WM9090

Production Data

PD, November 2010, Rev 4.1

PACKAGE DIMENSIONS

B: 20 BALL W-CSP PACKAGE 2.530 X 2.070 X 0.7mm BODY, 0.50 mm BALL PITCH

CORNER

TOP VIEW

0.10

2 X

DETAIL 2

0.10

2 X

bbb

SOLDER BALL

DETAIL 1

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

0.219

2.000 BSC

2.070

0.250

1.500 BSC

0.500 BSC

2.530

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.700

0.391

0.416

0.441

0.754

0.646

0.244

0.269

0.040

0.036

0.044

0.314 BSC

BOTTOM VIEW

0.270

DETAIL 1

2.500

2.040

2.560

2.100

DM087.A

WM9090ECS/R Fiches technique(PDF) 80 Page - Wolfson Microelectronics plc

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