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M54HC373 Fiches technique(PDF) 17 Page - STMicroelectronics |
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M54HC373 Fiches technique(HTML) 17 Page - STMicroelectronics |
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17 / 29 page ![]() M54HCxxx - M54HCTxxx Package mechanical data Doc ID 17367 Rev 2 17/29 Figure 5. Ceramic DIL-16 package drawings Note: The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package. Connecting unused pins or metal lid to ground or to the power supply will not affect the electrical characteristics. Table 10. Ceramic DIL-16 package dimensions Dim. mm. Min. Typ. Max. A 2.10 2.71 a1 3.00 3.70 a2 0.63 0.88 1.14 B 1.82 2.39 b 0.40 0.45 0.50 b1 0.20 0.254 0.30 D 20.06 20.32 20.58 E 7.36 7.62 7.87 e 2.54 e1 17.65 17.78 17.90 e2 7.62 7.87 8.12 F 7.29 7.49 7.70 I 3.83 K 10.90 12.10 L 1.14 1.50 |
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