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M54HC08 Fiches technique(PDF) 14 Page - STMicroelectronics |
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M54HC08 Fiches technique(HTML) 14 Page - STMicroelectronics |
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14 / 29 page ![]() Package mechanical data M54HCxxx - M54HCTxxx 14/29 Doc ID 17367 Rev 2 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 2. Ceramic Flat-14 mechanical drawings Note: The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package. Connecting unused pins or metal lid to ground or to the power supply will not affect the electrical characteristics. Table 7. Ceramic Flat-14 mechanical data Dim. mm. Min. Typ. Max. A 6.75 6.91 7.06 B 9.76 9.95 10.14 C 1.49 1.95 D 0.10 0.127 0.15 E 7.50 7.62 7.75 F 1.27 G 0.38 0.43 0.48 H 6.0 L 18.75 en 22.0 M 0.38 N 4.31 016029E 1 7 8 14 F G D H A B M N H C L E |
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