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ADP2380AREZ-R7 Fiches technique(PDF) 27 Page - Analog Devices |
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ADP2380AREZ-R7 Fiches technique(HTML) 27 Page - Analog Devices |
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27 / 28 page ![]() Data Sheet ADP2380 Rev. 0 | Page 27 of 28 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-153-ABT 16 9 8 1 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. BOTTOM VIEW TOP VIEW 9 16 1 8 PIN 1 INDICATOR 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 2.31 1.75 2.46 1.75 EXPOSED PAD 1.10 MAX SEATING PLANE 0.15 MAX 0.05 MIN COPLANARITY 0.076 0.95 0.90 0.85 0.30 0.19 0.65 BSC 0.20 0.09 0.25 8° 0° 0.70 0.60 0.50 Figure 42. 16-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP_EP] (RE-16-3) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADP2380AREZ-R7 −40°C to +125°C 16-Lead TSSOP_EP, 7”Tape and Reel RE-16-3 ADP2380AREZ −40°C to +125°C 16-Lead TSSOP_EP, Tube RE-16-3 ADP2380-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. |
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