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LT6201 Fiches technique(PDF) 19 Page - Linear Technology |
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LT6201 Fiches technique(HTML) 19 Page - Linear Technology |
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19 / 20 page ![]() LTC2315-12 19 231512f For more information www.linear.com/2315-12 package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.22 – 0.36 8 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) TS8 TSOT-23 0710 REV A 2.90 BSC (NOTE 4) 0.65 BSC 1.95 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.40 MAX 0.65 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN 2.62 REF 1.22 REF TS8 Package 8-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1637 Rev A) Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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