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VLF10045 Fiches technique(PDF) 13 Page - Richtek Technology Corporation |
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VLF10045 Fiches technique(HTML) 13 Page - Richtek Technology Corporation |
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13 / 15 page ![]() RT7272B 13 DS7272B-01 January 2013 www.richtek.com Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. © (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm 2 , θJA = 54°C/W (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm2 , θJA = 49°C/W Figure 6. Thermal Resistance vs. Copper Area Layout Design Layout Considerations For best performance of the RT7272B, the following layout guidelines must be strictly followed. Input capacitor must be placed as close to the IC as possible. SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace. The RL resistor, compensator and feedback components must be connected as close to the device as possible. |
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