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VLF10045 Fiches technique(PDF) 13 Page - Richtek Technology Corporation

No de pièce VLF10045
Description  RT7237C
PDF  15 Pages
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Fabricant  RICHTEK [Richtek Technology Corporation]
Site Internet  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

VLF10045 Fiches technique(HTML) 13 Page - Richtek Technology Corporation

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RT7237C
13
DS7237C-04
November 2012
www.richtek.com
©
Copyright
2012 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
(a) Copper Area = (2.3 x 2.3) mm2,
θJA = 75°C/W
(b) Copper Area = 10mm2,
θJA = 64°C/W
(c) Copper Area = 30mm
2 ,
θJA = 54°C/W
(d) Copper Area = 50mm2 ,
θJA = 51°C/W
(e) Copper Area = 70mm
2 ,
θJA = 49°C/W
Figure 6. Thermal Resistance vs. Copper Area Layout
Design
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of the RT7237C.
Keep the traces of the main current paths as short and
wide as possible.
Put the input capacitor as close as possible to the device
pins (VIN and GND).
SW node is with high frequency voltage swing and
should be kept at small area. Keep analog components
away from the SW node to prevent stray capacitive noise
pick-up.
Connect feedback network behind the output capacitors.
Keep the loop area small. Place the feedback
components near the RT7237C.
An example of PCB layout guide is shown in Figure 8
for reference.



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